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Xinzheng Dia Abrasives Co.,Ltd

Xinzheng Dia Abrasives Co.,Ltd

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Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry

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Xinzheng Dia Abrasives Co.,Ltd
Country/Region:china
Contact Person:Kevin
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China Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry wholesale
  • China Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry wholesale

Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry
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Video Channel
MOQ :1PC
Price :Negotiable
Payment Terms :T/T
Supply Ability :20000 pcs per month capacity
Delivery Time :15-20 days delivery time
Packaging Details :Box
Place of Origin :China
Certification :High QC standard, 100% inspection
Common Shape :1A8, 1A1R, 3A1
Wheel Size :"OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8"
Application :Semiconductor & Photoelectricity
Bond :Resin Metal
Advantage :high precision
Grit size :3um-70um
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Metal & Resin Bond Dicing Blade

Ultra thin dicing blades are widely used in semiconducto industry

Features:

  • Metal bond can hold grit size strongly
  • high precision
  • good shape holding
  • good wear resistant and long using life

Specification:

Specifications: Application
Common Shape Wheel Size Grit Size Classic Specification Industry Workpiece&Material Machine Bond Working Data
1A8, 1A1R OD:10-200
T:0.07-2.0
H:6, 8, 12.7, 31.75,50.8		 3um-70um 　 semiconductor industry
optical glass industry
optical communication		 BGA, LGA, LED
Blue glass, crystal, gem, filter
quartz		 　 Resin
Metal		 　

Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry

Product Tags:

grinding wheel for semiconductor and photoelectricity

grinding wheel for cutting tools industry

polishing wheel grinder
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