The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.

Features:

Good surface quality
High efficiency
No scratch
No chipping
Long using life

Specification:

Specifications:				Application
Common Shape	Wheel Size	Grit Size	Classic Specification	Industry	Workpiece&Material	Machine	Bond	Working Data
6A2, 6A2T, 1A1	OD: 175,195,209,305,255,355	Coarse Grit: 270--800 Finish Grit: 2000--8000	6A2 175D 30T 76H 6A2 200D 35T 76H 6A2T 280D 30T 228.6H 1A1 40D 5T 18.7H	Semiconductor industry	Sapphire, silicon wafer	SHUWA, NTS, WEC, GALAXY. SPEEDFAM DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER	Vitrified Metal

Long Using Life Back Grinding Wheel , Vitrified Bond Grinding Wheel

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Long Using Life Back Grinding Wheel , Vitrified Bond Grinding Wheel

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