Xinzheng Dia Abrasives Co.,Ltd

Xinzheng Dia Abrasives Co.,Ltd

Manufacturer from China
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6 Years
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High Efficiency Grinding Wheel For Semiconductor And Photoelectricity Industry

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Xinzheng Dia Abrasives Co.,Ltd
Country/Region:china
Contact Person:Kevin
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High Efficiency Grinding Wheel For Semiconductor And Photoelectricity Industry

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MOQ :1PC
Price :Negotiable
Payment Terms :T/T
Supply Ability :20000 pcs per month capacity
Delivery Time :15-20 days delivery time
Packaging Details :Box
Place of Origin :China
Certification :High QC standard, 100% inspection
Common Shape :6A2, 6A2T
Feature :No chipping
Wheel Size :OD: 175,195,209,305,255,355
Bond :Vitrified
Application :Semiconductor And Photoelectricity industry
Key word :Vitrified Bond Back Thinning Wheels
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Vitrified & Metal Bond Back Thinning Wheels​

The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.

Features:

  1. ​Good surface quality
  2. High efficiency
  3. No scratch
  4. No chipping
  5. Long using life

Specification:

Specifications: Application
Common Shape Wheel Size Grit Size Classic Specification Industry Workpiece&Material Machine Bond Working Data
6A2, 6A2T, 1A1 OD: 175,195,209,305,255,355 Coarse Grit: 270--800
Finish Grit: 2000--8000
6A2 175D 30T 76H
6A2 200D 35T 76H
6A2T 280D 30T 228.6H
1A1 40D 5T 18.7H
Semiconductor industry Sapphire, silicon wafer SHUWA, NTS, WEC, GALAXY. SPEEDFAM
DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER
Vitrified
Metal
 
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