The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.

Features:

Good surface quality
High efficiency
No scratch
No chipping
Long using life

Specification:

Specifications:				Application
Common Shape	Wheel Size	Grit Size	Classic Specification	Industry	Workpiece&Material	Machine	Bond	Working Data
6A2, 6A2T, 1A1	OD: 175,195,209,305,255,355	Coarse Grit: 270--800 Finish Grit: 2000--8000	6A2 175D 30T 76H 6A2 200D 35T 76H 6A2T 280D 30T 228.6H 1A1 40D 5T 18.7H	Semiconductor industry	Sapphire, silicon wafer	SHUWA, NTS, WEC, GALAXY. SPEEDFAM DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER	Vitrified Metal

Vitrified Dond Diamond Grinding Wheels With No Scratch And Chipping

Diamond Grinding Wheel

CBN Grinding Wheel

Gemstone Grinding Wheel

Grinding Wheel For Automotive Industry

Grinding Wheel For Cutting Tools Industry

Grinding Wheel For Air Compressor Industry

Grinding Wheel For Bearing Industry

Mold And Die

Grinding Wheel For Roller Industry

Diamond Grinding Wheel For Glass

Grinding Wheel For Semiconductor And Photoelectricity

Grinding Wheel For Oil And Gas

Grinding Wheel For Woodworking

Dressing Tool For Grinding Wheel

Vitrified Dond Diamond Grinding Wheels With No Scratch And Chipping

vitrified diamond grinding wheels

vitrified bond diamond grinding wheel

resin bond diamond grinding wheel