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Xinzheng Dia Abrasives Co.,Ltd

Xinzheng Dia Abrasives Co.,Ltd

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Home / Products / Grinding Wheel For Semiconductor And Photoelectricity /

Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity

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Xinzheng Dia Abrasives Co.,Ltd
Country/Region:china
Contact Person:Kevin
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China Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity wholesale
  • China Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity wholesale

Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity
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Video Channel
MOQ :1PC
Price :Negotiable
Payment Terms :T/T
Supply Ability :20000 pcs per month capacity
Delivery Time :10-14 days delivery time
Packaging Details :Box
Place of Origin :China
Certification :High QC standard, 100% inspection
Common Shape :1A1R
Bond :Resin Metal
Application :Semiconductor industry, Optical glass, Quartz, Magnetic material, Steel, Ceramic
Feature :High Precision
Key word :Gang Cutting Blades
Grit size :#80-#3000
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High Precision Gang Cutting Blades​

Multiple pieces of cutting blades are used together, it requires all every piece with high dimension tolerance and flatness.

Specification:

Specifications: Application
Common Shape Wheel Size Grit Size Classic Specification Industry Workpiece&Material Machine Bond Working Data
1A1R OD: 50-400mm #80-#3000 　 Semiconductor industry, Optical glass, Quartz, Magnetic material, Steel, Ceramic Silicon, stone 　 Resin
Metal		 　

Features:

1. High precision cutting
2. High effciency cutting
3. High uniformity cutting


Product Tags:

grinding wheel for semiconductor and photoelectricity

grinding wheel for cutting tools industry

cutting grinding wheels
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